Analysis of Heat Transfer in Microchannel Heat Sink

Heat removal has become an important factor in the advancement of microelectronics due to drastically integrated density of chips in digital devices and increased current-voltage handling capability of power electronic devices. For thermal management, various types of cooling methods for microelectronics devices have been developed. Examples include extended surface (fins), the highly parallel air and liquid impingement systems, modular internal conduction enhancement and indirect and direct liquid cooling with water and dielectric coolants. The implementation of manifold microchannel heat sink, cooling micro heat pipes, pool boiling, multiphase flow, liquid metal heat sink and microchannel heat sink are also proposed for the cooling solution in microelectronics. The present work addresses electronic chips cooling with forced convection of alumina-water (ɸ=2.5%) in copper based single microchannel heat sinks by the help of CFD software FLUENT.